Electronic Packaging and Reliability
Our vision is to engineer novel, environmentally benign materials and manufacturing processes suitable for next generation high temperature and high power electronic systems. To accomplish this goal, we are working on many important aspects of this problem from shape-controlled synthesis of silver nanostructures to transient liquid phase sintering of metallic powders. We hope to develop new technologies that will enable the realization of wide-band gap semiconducting microsystems that will advance alternative energy control and conversion as well as smart in-situ monitoring of mechanical systems.
Research Interests
- Transient Liquid Phase Sintering
- Electronic Packaging for High Temperature Environments
- Solder Attach Interconnections
- Shape Controlled Synthesis of Metallic Nanostructures
- Pb-free Solder Assessment for Microelectronics
- Tin Whiskers Mitigation by Combinatorial Material Science Techniques
- Material Characterization
- Failure Analysis and Reliability
